The Internet of Everything (IoE) is the fastest growing technological trend in the world today. Broader than the Internet of Things (IoT), IoE is not just about connecting devices and people to the Internet, but also about providing intelligent, knowledge-based services. The technology of the future will be completely dominated by the IoE, it will be “all around us and will reside in the background of our lives”. Say no to plagiarism. Get a tailor-made essay on "Why Violent Video Games Shouldn't Be Banned"? Get an original essay IoE is built on three pillars: billions of everyday objects that need to be made intelligent, information-centric networks, and intelligent, knowledge-based networks services through real-time analysis of collected data. IoE is one of the most promising future technologies, as it integrates everyday life with technology, making everything intelligent and artificially intelligent. IoE is the advancement of technologies such as Internet of Things, Artificial Intelligence, Machine Learning etc., and their integration together. The systems will not only provide services, but will learn themselves to acquire knowledge, analyze the situation and provide a solution based on that. But each component to achieve IoE has its own challenges and limitations, which need to be addressed. The first pillar of the IoE consists of millions of everyday objects that need to be connected to the Internet. From industrial machines, electrical appliances, wearable devices, packaging technologies, medical devices, etc., all are being integrated into the network. Currently, traditional silicon chips are used to connect devices, but to become truly ubiquitous, electronics must be shaped so that they can be integrated with all kinds of objects: miniature, soft, flexible and wearable. Recent developments in printed electronics are paving the way towards low-cost, low-performance electronics. Defines a technology for creating electronic components on certain substrates using organic and inorganic inks. It offers the possibility of preparing microstructured layer stacks and thus thin film devices. Many packaging companies use printed electronics to develop smart labels, for anti-counterfeiting packaging techniques. In particular, pharmaceutical, healthcare, beauty products, appliances and food and beverage companies are increasingly using this technology, which improves safety and is disposable. The System in Package (SiP) concept has led to miniaturized and more powerful systems, where various components are stacked on top of each other, to create thin but extremely robust electronic components. The current Internet is built on Internet Protocol (IP)-based technology, where point-to-point communication occurs based on source and destination IP addresses. But with billions of smart objects connected to the Internet, there will be a flood of data flowing through the network in the coming years that current technology will not be able to handle. Furthermore, searching based on information on a search engine is a completely different thing from searching for sensor data from smart objects. For this reason, an information-centric network is being developed that makes data content directly addressable and routable, also known as Content-centric. network (CCN) or nominative data network. In CCN's security model, individual data is secured using encryption, rather than using additional layers of security features. When prompted by name, CCN provides the user with the named content from the nearest cache, then comes.